Take a Look at the Future of Embedded Imaging

We would like to welcome you on booth 1A58 in Stuttgart from 8th to 10th November 2016.

There we will present for the first time publicly our next generation of camera modules, including:

• UC-200, 13MP AF Micro Module with excellent digital zoom
• UC-310, 3MP Super Compact 10x Zoom
• UC-318, 3MP 18x Zoom
• UC-203GS, 1080p60 with Global Shutter and 3.3x Zoom, optimized for ITS
• Upcoming 4K models
• Various high-speed cameras

Common features to all new models:

• HDMI Output
• Gigabit Ethernet
• Onboard Linux, optionally programmable by the user
• USB2.0 device
• USB2.0 host
• 30pos LVDS + VISCA
• All interfaces are accessible via simple standard or custom break-out boards

Please contact us in advance if you want to make an appointment on our booth.